B24B 37/14
Characterised by the composition or properties of the plate materials
Official title: characterised by the composition or properties of the plate materials
B24B37/14 (Characterised by the composition or properties of the plate materials) appears on 57 US grants and 74 published applications in this corpus.
Search patents in B24B- Granted patents
- 57
- Published applications
- 74
- Assignees
- 49
- Inventors
- 198
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 2 |
| 2002 | 2 | 8 |
| 2003 | 6 | 1 |
| 2004 | 5 | 4 |
| 2005 | 3 | 5 |
| 2006 | 4 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 2 |
| 2009 | 2 | 3 |
| 2010 | 0 | 1 |
| 2011 | 1 | 3 |
| 2012 | 1 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 1 |
| 2015 | 0 | 2 |
| 2016 | 2 | 2 |
| 2017 | 0 | 5 |
| 2018 | 3 | 4 |
| 2019 | 2 | 4 |
| 2020 | 4 | 3 |
| 2021 | 2 | 2 |
| 2022 | 0 | 8 |
| 2023 | 0 | 3 |
| 2024 | 5 | 6 |
| 2025 | 3 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tool for modifying a support surface21 Jul 2026US 12,687,790 B2ASML Netherlands B. V.
- Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof29 Jul 2025US 12,370,649 B23M Innovative Properties Company
- Double-side or one-side machine tool3 Jun 2025US 12,318,883 B2Lapmaster Wolters GmbH
- Substrate transporter and substrate processing apparatus including substrate transporter25 Feb 2025US 12,237,194 B2Ebara Corporation
- Synthetic grindstone, synthetic grindstone assembly, and method of manufacturing synthetic grindstone6 Aug 2024US 12,053,854 B2Tokyo Diamond Tools Mfg. Co., Ltd.
- Substrate polishing apparatus28 May 2026US 2026/0145296 A1Samsung Electronics Co., Ltd.
- Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof23 Oct 2025US 2025/0326089 A13M Innovative Properties Company
- Disc Grinding for Semiconductor Wafers on Polishing System11 Sep 2025US 2025/0282021 A1Wolfspeed, Inc.
- Substrate processing control system, substrate processing control method, and program26 Sep 2024US 2024/0316720 A1Ebara Corporation
- Polishing system with platen for substrate edge control28 Mar 2024US 2024/0100646 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Raised island abrasive, method of use and lapping apparatus111US 6,769,969 B1Keltech Engineering · 2004
- Apparatus and method for reducing removal forces for CMP pads74US 6,036,586 AMicron Technology, Inc. · 2000
- Lapping tools52US 5,041,173 AKabushiki Kaisha Toshiba · 1991
- Magnetic force carrier and ring for a polishing apparatus48US 6,059,638 ALucent Technologies Inc. · 2000
- High speed flat lapping platen38US 8,062,098 B22011