Apparatus and method for reducing removal forces for CMP pads
AssigneeMicron Technology, Inc.
InventorTrent T. Ward
Life of this patent
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Abstract
An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
Claims15
A polishing apparatus for planarizing a substrate, comprising:
- a polishing pad with a polishing surface;
- a platen having a first surface for adhesive attachment of the polishing pad thereto, said platen including a coating of low-adhesion material thereon;
- a substrate carrier for holding a substrate against said polishing surface;
- and
- moving apparatus for moving said platen and substrate carrier relative to each other for polishing said substrate.
A platen for the planarizing substrate located in a polishing machine used in a polishing process of said substrate, said platen used with a polishing pad having an surface, said platen comprising a rigid member with a planar first surface coated wit a low-stick coating to which an attachment surface of a polishing pad having a polishing surface may be attached with an adhesive material applied to an attachment surface of said polishing pad for attaching said polishing pad to said platen.
Dependencies are inferred from the claim text.