B24B 37/16
Characterised by the shape of the lapping plate surface
Official title: characterised by the shape of the lapping plate surface, e.g. grooved
B24B37/16 (Characterised by the shape of the lapping plate surface) appears on 175 US grants and 160 published applications in this corpus.
Search patents in B24B- Granted patents
- 175
- Published applications
- 160
- Assignees
- 91
- Inventors
- 423
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 11 | 0 |
| 2001 | 6 | 4 |
| 2002 | 10 | 14 |
| 2003 | 17 | 14 |
| 2004 | 13 | 11 |
| 2005 | 12 | 14 |
| 2006 | 12 | 2 |
| 2007 | 8 | 8 |
| 2008 | 3 | 5 |
| 2009 | 3 | 3 |
| 2010 | 2 | 1 |
| 2011 | 2 | 4 |
| 2012 | 1 | 3 |
| 2013 | 2 | 4 |
| 2014 | 3 | 7 |
| 2015 | 3 | 7 |
| 2016 | 4 | 3 |
| 2017 | 5 | 7 |
| 2018 | 8 | 7 |
| 2019 | 2 | 10 |
| 2020 | 10 | 8 |
| 2021 | 1 | 5 |
| 2022 | 5 | 2 |
| 2023 | 7 | 7 |
| 2024 | 4 | 5 |
| 2025 | 2 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tool for modifying a support surface21 Jul 2026US 12,687,790 B2ASML Netherlands B. V.
- Systems and methods for suction pad assemblies26 May 2026US 12,642,056 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Grind wheel design for low edge-roll grinding27 Jan 2026US 12,533,767 B2Wolfspeed, Inc.
- Surface height measurement method using dummy disk25 Mar 2025US 12,257,666 B2Ebara Corporation
- Microreplicated polishing surface with enhanced co-planarity28 Jan 2025US 12,208,483 B23M Innovative Properties Company
- Superhard material abrasive tool and grinding process for difficult-to-machine materials18 Jun 2026US 2026/0166679 A1Guilin Champion Union Diamond Co., Ltd.
- Grind Wheel Design for Low Edge-Roll Grinding28 May 2026US 2026/0145290 A1Wolfspeed, Inc.
- Substrate grinding tool and methods of operation27 Nov 2025US 2025/0364257 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Grind Wheel Design for Low Edge-Roll Grinding11 Sep 2025US 2025/0282016 A1Wolfspeed, Inc.
- Substrate lapping apparatus and substrate lapping method using the same24 Jul 2025US 2025/0235980 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Superabrasive tool and method of manufacturing the same142US 6,312,324 B1Osaka Diamond Industrial Co., Ltd. · 2001
- Method and apparatus for plating and polishing a semiconductor substrate132US 6,328,872 B1Nutool, Inc. · 2001
- Method of processing a wafer utilizing a processing slurry77US 6,116,988 AMicron Technology, Inc. · 2000
- Wafer processing apparatus and method of processing a wafer utilizing a processing slurry76US 6,074,286 AMicron Technology, Inc. · 2000
- Wafer processing apparatus75US 6,234,874 B1Micron Technology, Inc. · 2001