Wafer processing apparatus

A wafer processing system comprising:

• a processing disk assembly including
• a processing disk body, and
• a plurality of processing teeth secured to said processing disk body, wherein said plurality of processing teeth project from said disk body to define respective processing surfaces, wherein said plurality of processing teeth include at least one pair of spaced adjacent teeth, wherein said spaced adjacent teeth define a processing channel there between, and wherein said processing channel is shaped such that the cross sectional area of said processing channel decreases as a function of its distance from the processing disk body;
• a mounted wafer assembly, and
• a driving assembly coupled to at least one of said processing disk assembly and said mounted wafer assembly and operative to rotate one of said processing disk assembly and said mounted wafer assembly relative to the other of said processing disk assembly and said mounted wafer assembly.

A wafer processing system comprising:

• a processing disk assembly including
• a processing disk body, and
• a plurality of processing teeth secured to said processing disk body, wherein said plurality of processing teeth project from said disk body to define respective processing surfaces, wherein said plurality of processing teeth include at least one pair of spaced adjacent teeth having opposing walls inclined with respect to said processing surfaces such that said opposing walls define a processing channel decreasing in width from said processing disk body,
• a mounted wafer assembly;
• and
• a driving assembly coupled to at least one of said processing disk assembly and said mounted wafer assembly and operative to rotate one of said processing disk assembly and said mounted wafer assembly relative to the other of said processing disk assembly and said mounted wafer assembly.

A wafer processing system comprising:

• a processing disk assembly including
• a processing disk body defining a processing fluid passage and including at least one processing fluid port in fluid communication with said fluid passage, and
• a plurality of processing teeth secured to said processing disk body, wherein said plurality of processing teeth include at least one pair of spaced adjacent teeth, wherein said spaced adjacent teeth define a processing channel, and wherein said fluid port is positioned in said processing channel;
• a mounted wafer assembly;
• and
• a driving assembly coupled to at least one of said processing disk assembly and said mounted wafer assembly and operative to rotate one of said processing disk assembly and said mounted wafer assembly relative to the other of said processing disk assembly and said mounted wafer assembly.

A wafer processing system comprising:

• a processing disk assembly including
• a processing disk body, and
• a plurality of processing teeth secured to said processing disk body, wherein
• each of said plurality of processing teeth project from said disk body to define respective processing surfaces,
• at least one of said processing teeth includes a subsurface channel spaced from said processing surface in the direction of said processing disk body, bounded on one side by said disk body, and extending through opposite sides of said at least one processing tooth,
• said processing disk body defines a processing fluid passage and includes at least one processing fluid port in fluid communication with said fluid passage and positioned in said subsurface channel,
• said plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel, and wherein
• an additional fluid port is positioned in said processing channel;
• a mounted wafer assembly;
• and
• a driving assembly coupled to at least one of said processing disk assembly and said mounted wafer assembly and operative to rotate one of said processing disk assembly and said mounted wafer assembly relative to the other of said processing disk assembly and said mounted wafer assembly.

A wafer processing system comprising:

• a processing disk assembly including
• a processing disk body, and
• a plurality of processing teeth secured to said processing disk body, wherein
• said plurality of processing teeth project from said disk body to define respective processing surfaces,
• said plurality of processing teeth include at least one pair of spaced adjacent teeth having opposing walls inclined with respect to said processing surfaces such that said opposing walls define a processing channel decreasing in width from said processing disk body,
• the width of said processing channel decreases continuously to a zero value as a function of its distance from said processing disk body,
• said processing disk body defines a processing fluid passage and includes at least one processing fluid port in fluid communication with said fluid passage, and wherein
• said processing fluid port is positioned in said processing channel;
• a mounted wafer assembly;
• and
• a driving assembly coupled to at least one of said processing disk assembly and said mounted wafer assembly and operative to rotate one of said processing disk assembly and said mounted wafer assembly relative to the other of said processing disk assembly and said mounted wafer assembly.

A method of processing a wafer surface comprising the steps of:

• positioning a processing disk adjacent said wafer surface;
• causing said processing disk to move relative to said wafer surface;
• distributing a first processing slurry over said wafer surface as said processing disk moves relative to said wafer surface, wherein said first processing slurry comprises a first processing fluid and coarse processing particles, and wherein said coarse processing particles are urged against said wafer surface by said positioning and said movement of said processing disk;
• and
• distributing a second processing slurry over said wafer surface as said processing disk moves relative to said wafer surface, wherein said second processing slurry comprises a second processing fluid and fine processing particles, wherein said coarse processing particles are larger than said fine processing particles, and wherein said fine processing particles are urged against said wafer surface by said positioning and said movement of said processing disk.