B24B 37/22
Characterised by a multi-layered structure
Official title: characterised by a multi-layered structure
B24B37/22 (Characterised by a multi-layered structure) appears on 394 US grants and 524 published applications in this corpus.
Search patents in B24B- Granted patents
- 394
- Published applications
- 524
- Assignees
- 155
- Inventors
- 929
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 7 | 2 |
| 2002 | 8 | 13 |
| 2003 | 13 | 7 |
| 2004 | 8 | 33 |
| 2005 | 15 | 21 |
| 2006 | 11 | 14 |
| 2007 | 24 | 13 |
| 2008 | 11 | 8 |
| 2009 | 9 | 7 |
| 2010 | 7 | 13 |
| 2011 | 4 | 11 |
| 2012 | 4 | 9 |
| 2013 | 10 | 17 |
| 2014 | 8 | 20 |
| 2015 | 16 | 25 |
| 2016 | 11 | 23 |
| 2017 | 17 | 28 |
| 2018 | 22 | 35 |
| 2019 | 26 | 26 |
| 2020 | 19 | 29 |
| 2021 | 11 | 25 |
| 2022 | 14 | 24 |
| 2023 | 28 | 39 |
| 2024 | 19 | 38 |
| 2025 | 21 | 26 |
| 2026 | 20 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable composition and abrasive articles made using the same6 Oct 2026US 12,753,266 B23M Innovative Properties Company
- Membrane coating compound for chemical mechanical polishing process, membrane including the same, and polishing apparatus including the same15 Sep 2026US 12,734,637 B2Samsung Electronics Co., Ltd.
- Polishing pad, method for producing the same and method of fabricating semiconductor device using the same1 Sep 2026US 12,722,245 B2Enpulse Co., Ltd.
- Polishing pad and method for manufacturing semiconductor device using the same1 Sep 2026US 12,722,246 B2Enpulse Co., Ltd.
- Polishing pad, double-side polishing device, and double-side polishing method for wafer11 Aug 2026US 12,703,059 B2Shin-Etsu Handotai Co., Ltd.
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Polishing pad24 Sep 2026US 2026/0284828 A1Hubei Dinghui Microelectronics Materials Co., Ltd
- Abrasive articles and method of making the same20 Aug 2026US 2026/0241515 A13M Innovative Properties Company
- Substrate polishing device and polishing pad13 Aug 2026US 2026/0233356 A1Ebara Corporation
- Chemical planarization16 Jul 2026US 2026/0206512 A1Chempower Corporation
Most cited
By later US patents
- Composite polishing pad for semiconductor process226US 5,212,910 AIntel Corporation · 1993
- Apparatus for interlayer planarization of semiconductor material209US 5,257,478 ARodel, Inc. · 1993
- Abrasive construction for semiconductor wafer modification151US 5,692,950 AMinnesota Mining and Manufacturing Company · 1997
- Polishing pad and method of use114US 5,733,176 AMicron Technology, Inc. · 1998
- Method and apparatus for depositing and controlling the texture of a thin film113US 6,409,904 B1Nutool, Inc. · 2002