Polishing pad, method for producing the same and method of fabricating semiconductor device using the same

A polishing pad comprising a polishing layer,

• wherein the polishing layer comprises a cured product of a prepolymer composition containing a polyurethane-based prepolymer,
• wherein the polyurethane-based prepolymer has a weight-average molecular weight (Mw) of about 500 g/mol to about 3,000 g/mol,
• wherein a viscosity of the prepolymer composition is from 100 cps to 1,000 cps at 80° C.,
• wherein the polishing layer contains:
• a plurality of micropores each having a shell;
• and an inorganic component,
• wherein the shell is derived from an expandable solid foaming agent,
• wherein the micropores have a value of 0.7 to 0.8 as calculated according to the following ratio:
• D
• ⁢
• 10
• D
• ⁢
• 50
• wherein
• D10 represents a diameter of pores in a 10% volume cumulative distribution, and
• D50 represents a diameter of pores in a 50% volume cumulative distribution,
• wherein the micropores have a standard deviation of 4 to 10 for measured values of D10 to D100, and
• wherein the inorganic component is Mg and is contained in an amount of 0.01 to 1 ppm based on the total weight of the polishing layer.