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US 5,733,176 AGranted
Polishing pad and method of use
AssigneeMicron Technology, Inc.
InventorsKarl M. Robinson, Michael A. Walker
Life of this patent
Estimating the term…
Abstract
A novel polishing pad having voids and optional abrasives incorporated therein is disclosed. The contents of each void facilitates the detection of the end point at which the polishing pad becomes worn out during a polishing operation. Chemicals stored within voids are released by the breaching of the voids caused by the polishing operation. The chemical released is selected to halt the chemical polishing, change the color of the pad, or to detectably change the torque load on the rotating fixed abrasive pad. Empty voids cause an noise from fluids such as air being forced into the voids. The visual or audible diagnostic resulting from the breaching of voids help to control the polishing operation and thus increase yield.
Claims62
A polishing pad comprising:
- an elastomeric substance having a polishing surface;
- and
- an end point indicator substance comprising a fluid incorporated within the elastomeric substance beneath the polishing surface for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance therefrom.
A polishing system comprising:
- a polishing pad including:
- a composite substance having a polishing surface;
- and
- an end point indicator substance comprising a fluid incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom;
- a semiconductor substrate having a surface to be polished by said polishing pad;
- and
- a tool for moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
4 more elements
A method of detecting the wear end-point of a polishing pad comprising the steps of:
- providing a polishing pad including:
- a composite substance having a polishing surface;
- and
- an end point indicator substance comprising a fluid incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom;
- providing a semiconductor substrate having a unpolished surface to be polished by said polishing pad;
- moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance;
- and
- detecting said detectable signal when the composite substance releases the end point indicator substance therefrom;
- whereby a status of said polishing pad is indicated.
6 more elements
A polishing pad comprising:
- an elastomeric substance having a polishing surface;
- and
- a void, incorporated within the elastomeric substance beneath the polishing surface and containing therein an end point indicator substance comprising a fluid, wherein a detectable signal is produced as abrading of the elastomeric substance releases the end point indicator substance from said void.
A polishing pad comprising:
- an elastomeric substance having a polishing surface;
- and
- a lubricant incorporated within the elastomeric substance beneath the polishing surface for producing a change in a coefficient of friction between the elastomeric substance in contact with a polished surface as abrading of the elastomeric substance releases the end point indicator substance therefrom.
A polishing pad comprising:
- an elastomeric substance having a polishing surface;
- and
- a material causing an exothermic reaction when exposed to the ambient outside the elastomeric substance, said material being incorporated within the elastomeric substance beneath the polishing surface and producing a change in the temperature of the elastomeric substance as abrading of the elastomeric substance releases the material therefrom.
A polishing pad comprising:
- an elastomeric substance having a polishing surface;
- and
- a void incorporated within the elastomeric substance beneath the polishing surface, said void being partially filled with an end point indicator substance for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance from said void.
A polishing system comprising:
- a polishing pad including:
- a composite substance having a polishing surface;
- and
- a lubricant, incorporated within the composite substance beneath the polishing surface, for producing a change in a coefficient of friction between the composite substance in contact with a polished surface as abrading of the composite substance releases the end point indicator substance therefrom;
- a semiconductor substrate having a surface to be polished by said polishing pad;
- and
- a tool for moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
4 more elements
A polishing system comprising:
- a polishing pad including:
- a composite substance having a polishing surface;
- and
- end point indicator substance incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom;
- a semiconductor substrate having a surface to be polished by said polishing pad, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid;
- and
- a tool for moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
4 more elements
A polishing system comprising:
- a polishing pad including:
- a composite substance having a polishing surface;
- and
- a void incorporated within the elastomeric substance beneath the polishing surface and partially filled with an end point indicator substance for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance from said void;
- a semiconductor substrate having a surface to be polished by said polishing pad;
- and
- a tool or moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
4 more elements
A method of detecting the wear end-point of a polishing pad comprising:
- providing a polishing pad including:
- a composite substance having a polishing surface;
- and
- a lubricant incorporated within the elastomeric substance beneath the polishing surface for producing a detectable signal comprising a change in a coefficient of friction between the elastomeric substance in contact with a polished surface as abrading of the elastomeric substance releases the end point indicator substance therefrom;
- providing a semiconductor substrate having a unpolished surface to be polished by said polishing pad;
- moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance;
- and
- detecting said detectable signal when the composite substance releases the end point indicator substance therefrom;
- whereby a status of said polishing pad is indicated.
6 more elements
A method of detecting the wear end-point of a polishing pad comprising:
- providing a polishing pad including:
- a composite substance having a polishing surface;
- and
- end point indicator substance incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom;
- providing a semiconductor substrate having a surface to be polished by said polishing pad, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid;
- moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance;
- and
- detecting said detectable signal when the composite substance releases the end point indicator substance therefrom;
- whereby a status of said polishing pad is indicated.
6 more elements
A method of detecting the wear end-point of a polishing pad comprising:
- providing a polishing pad including:
- a composite substance having a polishing surface;
- and
- a void incorporated within the elastomeric substance beneath the polishing surface and partially filled with an end point indicator substance for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance from said void;
- providing a semiconductor substrate having a surface to be polished by said polishing pad, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid;
- moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance;
- and
- detecting said detectable signal when the composite substance releases the end point indicator substance therefrom;
- whereby a status of said polishing pad is indicated.
6 more elements
Dependencies are inferred from the claim text.