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US 5,212,910 AGranted
Composite polishing pad for semiconductor process
AssigneeIntel Corporation
InventorsJoseph R. Breivogel, Sam F. Louke, Michael R. Oliver, Leo D. Yau
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AssigneeIntel Corporation
InventorsJoseph R. Breivogel, Sam F. Louke, Michael R. Oliver, Leo D. Yau
Estimating the term…
An improved composite polishing pad includes a first layer of elastic material, a second, stiff layer and a third layer optimized for slurry transport. This third layer is the layer against which the wafer makes contact during the polishing process. The second layer is segmented into individual sections physically isolated from one another in the lateral dimension. Each segmented section is resilient across its width yet cushioned by the first layer in the vertical direction. The physical isolation of each section combined with the cushioning of the first layer of material create a sort of "bedspring" effect which enables the pad to conform to longitudinal gradations across the wafer.
In an apparatus for planarizing a surface of a semiconductor substrate said apparatus including a support table covered with a polishing pad, a means for coating said pad with an abrasive slurry, and a means for forcibly pressing said substrate against said pad such that movement of said substrate relative to said table results in planarization of said surface, an improved polishing pad comprising:
In an apparatus for planarizing localized height variations across a surface of a semiconductor substrate, said substrate also having longitudinal gradations in height across said surface, said apparatus including a support table covered with a polishing pad, a means for coating said pad such that movement of said substrate relative to said table planarizes said localized height variations, an improved polishing pad comprising:
In an apparatus for planarizing localized height variations of a dielectric layer formed on a surface of a semiconductor substrate, said substrate also exhibiting longitudinal gradations in height across said surface, said apparatus including a support table covered with a polishing pad, a means for coating said pad with an abrasive slurry, and a means for pressing said substrate against said pad such that movement of said substrate relative to said table planarizes said localized height variations, an improved polishing pad comprising:
Dependencies are inferred from the claim text.