B24B 37/26
Characterised by the shape of the lapping pad surface
Official title: characterised by the shape of the lapping pad surface, e.g. grooved
B24B37/26 (Characterised by the shape of the lapping pad surface) appears on 872 US grants and 915 published applications in this corpus.
Search patents in B24B- Granted patents
- 872
- Published applications
- 915
- Assignees
- 254
- Inventors
- 1,552
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 10 | 0 |
| 1997 | 12 | 0 |
| 1998 | 15 | 0 |
| 1999 | 29 | 0 |
| 2000 | 39 | 0 |
| 2001 | 48 | 37 |
| 2002 | 58 | 54 |
| 2003 | 58 | 49 |
| 2004 | 47 | 63 |
| 2005 | 54 | 46 |
| 2006 | 48 | 49 |
| 2007 | 41 | 42 |
| 2008 | 21 | 31 |
| 2009 | 20 | 27 |
| 2010 | 15 | 12 |
| 2011 | 15 | 18 |
| 2012 | 12 | 28 |
| 2013 | 15 | 33 |
| 2014 | 20 | 24 |
| 2015 | 22 | 32 |
| 2016 | 23 | 33 |
| 2017 | 18 | 37 |
| 2018 | 28 | 34 |
| 2019 | 26 | 35 |
| 2020 | 28 | 39 |
| 2021 | 15 | 31 |
| 2022 | 17 | 32 |
| 2023 | 32 | 41 |
| 2024 | 29 | 31 |
| 2025 | 22 | 27 |
| 2026 | 16 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Grooves for edge and hot spot compensation in chemical mechanical polishing15 Sep 2026US 12,734,638 B2APPLIED Materials.Inc.
- Polishing pad and method for manufacturing semiconductor device using the same1 Sep 2026US 12,722,246 B2Enpulse Co., Ltd.
- Polishing pad and method for manufacturing polishing pad1 Sep 2026US 12,722,247 B2Fujibo Holdings, Inc.
- Recycled polishing pad and preparation method thereof4 Aug 2026US 12,697,698 B2Enpulse Co., Ltd.
- Chemical mechanical polishing apparatus16 Jun 2026US 12,660,542 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Slurry recycling for chemical mechanical planarazation system8 Oct 2026US 2026/0307209 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing tool and method10 Sep 2026US 2026/0264193 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing pad, polishing method, and method for manufacturing semiconductor27 Aug 2026US 2026/0249420 A1Kuraray Co., Ltd.
- Substrate polishing device and polishing pad13 Aug 2026US 2026/0233356 A1Ebara Corporation
- Chemical planarization16 Jul 2026US 2026/0206512 A1Chempower Corporation
Most cited
By later US patents
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B1Nutool, Inc. · 2001
- Polishing pad conditioning apparatus for wafer planarization process292US 5,216,843 AIntel Corporation · 1993
- Polishing pads and methods for their use283US 5,489,233 ARodel, Inc. · 1996
- Polishing pads268US 5,605,760 ARodel, Inc. · 1997
- Polymeric polishing pad containing hollow polymeric microelements245US 5,578,362 ARodel, Inc. · 1996