Recycled polishing pad and preparation method thereof

A process for preparing a recycled polishing pad, which comprises:

• recovering a polishing layer from a polishing pad used in a CMP process;
• planarizing one side of the polishing layer;
• forming a groove on one side of the planarized polishing layer to prepare a reused polishing layer;
• and
• attaching a cushion layer to the other side of the reused polishing layer using an adhesive,
• wherein the compressibility of the reused polishing layer calculated by Equation 1 is 0.9% or more,
• Compressibility
• ⁢
• of
• ⁢
• the
• ⁢
• reused
• ⁢
• polishing
• ⁢
• layer
• ⁢
• (
• %
• )
• =
• T
• ⁢
• 1
• -
• T
• ⁢
• 2
• T
• ⁢
• 1
• ×
• 1
• ⁢
• 0
• ⁢
• 0
• [
• Equation
• ⁢
• 1
• ]
• in Equation 1, T1 is the thickness (mm) of the reused polishing layer measured when the reused polishing layer is pressed with a load of 85 g for 30 seconds, and
• T2 is the thickness (mm) of the reused polishing layer measured when the reused polishing layer is further pressed with a load of 885 g for 3 minutes after T1 is measured, and
• wherein the recycled polishing pad has a structure in which the cushion layer, an adhesive layer, and the reused polishing layer are sequentially laminated while in contact with each other, and
• wherein the ratio of the depth of the groove to the thickness of the reused polishing layer is 0.1 to 0.7.