Chemical mechanical polishing apparatus

An apparatus comprising:

• a carrier configured to secure an object;
• a polishing pad configured to press against the object;
• and
• a pad conditioner configured to condition the polishing pad, the pad conditioner comprising:
• a conditioning disk;
• a conditioning arm comprising a plurality of magnetic screw holes;
• a plurality of magnetic screws configured to secure the conditioning disk onto the conditioning arm;
• and
• a blocking device positioned beneath a screw head of each of the plurality of magnetic screws and configured to block particles from dislodging from the plurality of magnetic screw holes.

A method, comprising:

• securing an object onto a carrier;
• pressing the object against a polishing pad;
• rotating the object and the polishing pad with respect to one another;
• and
• roughening the polishing pad using a pad conditioner, wherein the pad conditioner comprises a conditioning disk attached to a conditioning arm by a plurality of magnetic screws in a plurality of magnetic holes in the conditioning disk, and wherein the plurality of magnetic holes collect particles generated during movement of the conditioning disk.