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US 2026/0295770 A1Published application
Polishing pad and method for polishing object to be polished
AssigneeKureha Corporation
InventorsKenta USHIRO, Takahiro KUDO, Kazuyuki SUZUKI
Life of this patent
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Abstract
A polishing pad of the present invention includes a polishing layer. The polishing layer includes a composition containing a glycolic acid polymer and an abrasive grain.
Claims20
A polishing pad, comprising a polishing layer comprising a composition containing a glycolic acid polymer and an abrasive grain.
Dependencies are inferred from the claim text.