B24B 37/107
In a rotary movement only, about an axis being stationary during lapping
Official title: {in a rotary movement only, about an axis being stationary during lapping}
B24B37/107 (In a rotary movement only, about an axis being stationary during lapping) appears on 190 US grants and 200 published applications in this corpus.
Search patents in B24B- Granted patents
- 190
- Published applications
- 200
- Assignees
- 66
- Inventors
- 417
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 7 | 0 |
| 1998 | 5 | 0 |
| 1999 | 13 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 3 |
| 2002 | 8 | 2 |
| 2003 | 0 | 3 |
| 2004 | 2 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 7 |
| 2012 | 2 | 10 |
| 2013 | 7 | 6 |
| 2014 | 8 | 4 |
| 2015 | 4 | 12 |
| 2016 | 4 | 9 |
| 2017 | 13 | 11 |
| 2018 | 15 | 25 |
| 2019 | 9 | 13 |
| 2020 | 14 | 14 |
| 2021 | 8 | 14 |
| 2022 | 9 | 11 |
| 2023 | 13 | 13 |
| 2024 | 12 | 16 |
| 2025 | 12 | 15 |
| 2026 | 4 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Polishing apparatus for substrate and polishing method for substrate using the same1 Sep 2026US 12,722,250 B2Samsung Electronics Co., Ltd.
- Polishing head, polishing apparatus, and elastic body18 Aug 2026US 12,708,980 B2Kioxia Corporation
- Substrate processing apparatus and substrate processing method10 Mar 2026US 12,569,957 B2Ebara Corporation
- Polishing fixing device and polishing apparatus16 Dec 2025US 12,496,679 B2Fulian Yuzhan Precision Technology Co., Ltd
- Polishing apparatus, substrate processing apparatus, polishing method, and determination device17 Sep 2026US 2026/0273687 A1Ebara Corporation
- Substrate polishing device and polishing pad13 Aug 2026US 2026/0233356 A1Ebara Corporation
- Chemical mechanical polishing apparatus30 Jul 2026US 2026/0216843 A1Samsung Electronics Co., Ltd.
- Wafer polishing device16 Jul 2026US 2026/0200035 A1Samsung Electronics Co., Ltd.
- Wafer processing apparatus11 Jun 2026US 2026/0165071 A1Meere Company Inc.
Most cited
By later US patents
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing160US 5,700,180 AMicron Technology, Inc. · 1997
- Slurry polisher using ultrasonic agitation146US 5,245,796 AAT&T Bell Laboratories · 1993