B24B 37/10
For single side lapping
Official title: for single side lapping
B24B37/10 (For single side lapping) appears on 593 US grants and 673 published applications in this corpus.
Search patents in B24B- Granted patents
- 593
- Published applications
- 673
- Assignees
- 197
- Inventors
- 1,266
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 7 | 0 |
| 1997 | 17 | 0 |
| 1998 | 15 | 0 |
| 1999 | 32 | 0 |
| 2000 | 15 | 0 |
| 2001 | 21 | 6 |
| 2002 | 15 | 8 |
| 2003 | 7 | 4 |
| 2004 | 4 | 4 |
| 2005 | 10 | 9 |
| 2006 | 8 | 3 |
| 2007 | 3 | 7 |
| 2008 | 2 | 2 |
| 2009 | 1 | 4 |
| 2010 | 1 | 4 |
| 2011 | 2 | 19 |
| 2012 | 3 | 24 |
| 2013 | 13 | 12 |
| 2014 | 15 | 30 |
| 2015 | 21 | 37 |
| 2016 | 22 | 33 |
| 2017 | 31 | 43 |
| 2018 | 33 | 54 |
| 2019 | 36 | 52 |
| 2020 | 41 | 44 |
| 2021 | 23 | 54 |
| 2022 | 26 | 45 |
| 2023 | 52 | 49 |
| 2024 | 43 | 43 |
| 2025 | 30 | 52 |
| 2026 | 16 | 31 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Polishing apparatus1 Sep 2026US 12,722,244 B2Ebara Corporation
- Polishing apparatus for substrate and polishing method for substrate using the same1 Sep 2026US 12,722,250 B2Samsung Electronics Co., Ltd.
- Coated articles, methods of polishing, and methods of making the same25 Aug 2026US 12,715,079 B2Corning Incorporated
- Polishing head, polishing apparatus, and elastic body18 Aug 2026US 12,708,980 B2Kioxia Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece1 Oct 2026US 2026/0295767 A1Ebara Corporation
- Polishing device1 Oct 2026US 2026/0295769 A1Ebara Corporation
- Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece24 Sep 2026US 2026/0284826 A1Ebara Corporation
- Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece24 Sep 2026US 2026/0284827 A1Ebara Corporation
Most cited
By later US patents
- Method and apparatus for improving planarity of chemical-mechanical planarization operations307US 5,232,875 AMicron Technology, Inc. · 1993
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- Chemical mechanical polishing apparatus with improved carrier and method of use216US 5,624,299 AAPPLIED Materials.Inc. · 1997
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998