B24B 37/102
The workpieces or work carriers being able to rotate freely due to
Official title: {the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool}
B24B37/102 (The workpieces or work carriers being able to rotate freely due to) appears on 37 US grants and 12 published applications in this corpus.
Search patents in B24B- Granted patents
- 37
- Published applications
- 12
- Assignees
- 34
- Inventors
- 105
- Latest grant
- 29 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 2 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 3 |
| 2022 | 3 | 1 |
| 2023 | 0 | 1 |
| 2024 | 1 | 2 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer29 Apr 2025US 12,285,840 B2Sumco Corporation
- Polishing and loading/unloading component module14 Jan 2025US 12,194,592 B2Hangzhou Sizone Electronic Technology Inc.
- Vibration polishing device12 Mar 2024US 11,926,014 B2ATM Qness GmbH
- Vibration polishing device9 Aug 2022US 11,407,080 B2Atm S.A.
- Metallographic grinder and components thereof26 Jul 2022US 11,397,139 B2Leco Corporation
- Substrate processing apparatus and method of processing substrate using the same3 Jul 2025US 2025/0214198 A1Samsung Electronics Co., Ltd.
- Systems and methods to detect rotation of a vibratory polisher13 Jun 2024US 2024/0189958 A1Illinois Tool Works Inc.
- Vibration polishing device16 May 2024US 2024/0157501 A1ATM Qness GmbH
- Cmp process applied to a thin sic wafer for stress release and damage recovery27 Apr 2023US 2023/0128739 A1STMicroelectronics S,r.l.
- Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer26 May 2022US 2022/0161388 A1Sumco Corporation
Most cited
By later US patents
- Method and apparatus for improving planarity of chemical-mechanical planarization operations307US 5,232,875 AMicron Technology, Inc. · 1993
- Method for lapping a wafer material and an apparatus therefor148US 4,918,869 AFujikoshi Machinery Corp. · 1990
- Temperature control for wafer polishing134US 4,450,652 AMonsanto Company · 1984
- Methods and apparatus for polishing a semiconductor wafer127US 4,373,991 AWestern Electric Company, Inc. · 1983
- Floating subcarriers for wafer polishing apparatus97US 4,918,870 ASiltec Corporation · 1990