B24B 37/07
Characterised by the movement of the work or lapping tool
Official title: characterised by the movement of the work or lapping tool
B24B37/07 (Characterised by the movement of the work or lapping tool) appears on 935 US grants and 996 published applications in this corpus.
Search patents in B24B- Granted patents
- 935
- Published applications
- 996
- Assignees
- 329
- Inventors
- 1,928
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 11 | 0 |
| 1997 | 21 | 0 |
| 1998 | 19 | 0 |
| 1999 | 48 | 0 |
| 2000 | 36 | 0 |
| 2001 | 35 | 15 |
| 2002 | 26 | 25 |
| 2003 | 19 | 14 |
| 2004 | 16 | 21 |
| 2005 | 22 | 19 |
| 2006 | 23 | 12 |
| 2007 | 9 | 14 |
| 2008 | 5 | 16 |
| 2009 | 8 | 14 |
| 2010 | 6 | 18 |
| 2011 | 8 | 39 |
| 2012 | 13 | 41 |
| 2013 | 24 | 23 |
| 2014 | 31 | 44 |
| 2015 | 36 | 53 |
| 2016 | 33 | 40 |
| 2017 | 44 | 54 |
| 2018 | 41 | 65 |
| 2019 | 44 | 64 |
| 2020 | 48 | 56 |
| 2021 | 28 | 66 |
| 2022 | 33 | 58 |
| 2023 | 64 | 61 |
| 2024 | 54 | 60 |
| 2025 | 39 | 61 |
| 2026 | 22 | 43 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Polishing apparatus1 Sep 2026US 12,722,244 B2Ebara Corporation
- Polishing apparatus for substrate and polishing method for substrate using the same1 Sep 2026US 12,722,250 B2Samsung Electronics Co., Ltd.
- Coated articles, methods of polishing, and methods of making the same25 Aug 2026US 12,715,079 B2Corning Incorporated
- Polishing head, polishing apparatus, and elastic body18 Aug 2026US 12,708,980 B2Kioxia Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece1 Oct 2026US 2026/0295767 A1Ebara Corporation
- Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer1 Oct 2026US 2026/0295768 A1Siltronic AG
- Polishing device1 Oct 2026US 2026/0295769 A1Ebara Corporation
- Polishing apparatus and method for creating film thickness profile in polishing apparatus24 Sep 2026US 2026/0284825 A1Ebara Corporation
Most cited
By later US patents
- Method and apparatus for improving planarity of chemical-mechanical planarization operations307US 5,232,875 AMicron Technology, Inc. · 1993
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- Chemical mechanical polishing apparatus with improved carrier and method of use216US 5,624,299 AAPPLIED Materials.Inc. · 1997
- Wafer polishing method and apparatus209US 5,329,732 ASpeedfam Corporation · 1994