Polishing apparatus and method for creating film thickness profile in polishing apparatus

A method for creating a film thickness profile in a polishing apparatus:

• wherein
• the polishing apparatus comprises
• a polishing table which is provided with a sensor and constructed to be able to rotate, and
• a polishing head which is arranged to face the polishing table, constructed to be able to rotate, and constructed to allow a substrate to be attached to a surface facing the polishing table;
• and
• the method comprises steps for
• outputting, by the sensor when the sensor passes a path on the substrate, time series data that comprises a series of pieces of measurement data relating to film thicknesses at multiple measurement points on the path,
• obtaining the time series data from the sensor,
• applying interpolation using a first interpolation pitch to the measurement data in a first data range in the time series data,
• applying interpolation using a second interpolation pitch, that is different from the first interpolation pitch, to the measurement data in a second data range in the time series data, and
• creating a film thickness profile corresponding to the path, based on the interpolated measurement data in the first data range and the second data range.