B24B 37/08
For double side lapping
Official title: for double side lapping
B24B37/08 (For double side lapping) appears on 345 US grants and 316 published applications in this corpus.
Search patents in B24B- Granted patents
- 345
- Published applications
- 316
- Assignees
- 170
- Inventors
- 716
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 6 | 0 |
| 1999 | 16 | 0 |
| 2000 | 21 | 0 |
| 2001 | 14 | 9 |
| 2002 | 11 | 17 |
| 2003 | 12 | 10 |
| 2004 | 12 | 17 |
| 2005 | 12 | 11 |
| 2006 | 16 | 9 |
| 2007 | 6 | 7 |
| 2008 | 3 | 15 |
| 2009 | 7 | 10 |
| 2010 | 6 | 14 |
| 2011 | 6 | 21 |
| 2012 | 10 | 17 |
| 2013 | 12 | 11 |
| 2014 | 16 | 14 |
| 2015 | 15 | 16 |
| 2016 | 10 | 8 |
| 2017 | 12 | 11 |
| 2018 | 8 | 7 |
| 2019 | 10 | 12 |
| 2020 | 6 | 11 |
| 2021 | 6 | 8 |
| 2022 | 6 | 14 |
| 2023 | 9 | 12 |
| 2024 | 9 | 16 |
| 2025 | 9 | 9 |
| 2026 | 5 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Polishing pad, double-side polishing device, and double-side polishing method for wafer11 Aug 2026US 12,703,059 B2Shin-Etsu Handotai Co., Ltd.
- Method and disk carrier for use in polishing glass substrate disks7 Apr 2026US 12,594,645 B2Western Digital Technologies, Inc.
- Method of polishing carrier plate, carrier plate, and method of polishing semiconductor wafer3 Mar 2026US 12,568,784 B2Sumco Corporation
- Apparatus for double-side polishing work10 Feb 2026US 12,544,874 B2Sumco Corporation
- Simplified carrier removable by reduced number of CMP processes27 Jan 2026US 12,533,766 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer1 Oct 2026US 2026/0295768 A1Siltronic AG
- Substrate processing method and substrate processing apparatus17 Sep 2026US 2026/0282843 A1Tokyo Electron Limited
- Wafer lapping device and contol method thereof13 Aug 2026US 2026/0233353 A1SK Siltron Co., Ltd.
- Double-side polishing apparatus for workpiece and double-side polishing method for workpiece14 May 2026US 2026/0131416 A1Sumco Corporation
- Double or single-sided processing machine26 Mar 2026US 2026/0084261 A1Lapmaster Wolters GmbH
Most cited
By later US patents
- Wafer polishing method and apparatus209US 5,329,732 ASpeedfam Corporation · 1994
- Wafer polishing method and apparatus157US 5,498,199 ASpeedfam Corporation · 1996
- System for mechanical planarization107US 4,934,102 AInternational Business Machines Corporation · 1990
- Non-rotational dresser for grinding stones78US 6,206,765 B1Komag, Inc. · 2001
- Process and apparatus for abrasive machining of a wafer-like workpiece69US 4,739,589 AWacker-Chemitronic Gesellschaft fur Elektronik-Grundstoff mbH · 1988