System for mechanical planarization
AssigneeInternational Business Machines Corporation
InventorsMichael A. Leach, James K. Paulsen, Brian J. Machesney, Daniel J. Venditti, Christopher R. Whitaker
Life of this patent
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Abstract
A polishing tool for abrasively polishing a semiconductor wafer that edge clamps the wafer between two rollers. The wafer is spun-up in one plane and the rollers spin in a second plane which is orthogonal to the wafer spin plane. One of the rollers is split with each section rotating in opposite directions. Each of the rollers is mounted by a spring-gimballed assembly to follow the wafer contour.
Claims20
A polishing tool for removing a quantity of material from a workpiece comprising:
- a base;
- an abrasive member flexibly mounted on the base, means for rotating said abrasive member about a first axis of rotation;
- a support member holding said workpiece, means for flexibly mounting said support member on said base, means for rotating said support member about a second axis of rotation orthogonal to said first axis;
- and
- a split follower roller disposed below said support member and flexibly mounted on the base for supporting said workpiece in engagement with said abrasive member, said split follower roller rotating about a third axis of rotation parallel to said first axis.
A polishing tool for abrasively polishing a wafer comprising:
- a base;
- an abrasive member positioned relative to said wafer to polish one surface, said abrasive member flexibly mounted to said base to shift relative to said wafer, means for rotations said abrasive member about a first axis of rotation;
- a support member holding said wafer about an edge thereof, means for flexibly mounting said support member on said base to permit said wafer
- to shift relative to said based means for rotating said support member about an axis of rotation in a second plane perpendicular to said first plane;
- and
- a split follower roller, freely rotating in response to rotation of said wafer and supporting said wafer and maintaining it in engagement with said abrasive member, said split follower roller rotating about an axis of rotation in said first plane.
Dependencies are inferred from the claim text.