Process and apparatus for abrasive machining of a wafer-like workpiece
AssigneeWacker-Chemitronic Gesellschaft fur Elektronik-Grundstoff mbH
InventorsGerhard Brehm, Ingo Haller, Otto Rothenaicher, Karl H. Langsdorf
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Abstract
A process is provided for bilateral abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm.sup.2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material having an elasticity modulus of from 1.0 to 8.10.sup.4 N/mm.sup.2.
Claims7
In a process for the bilateral abrasive machining of wafer-like workpieces having an upper and lower surface and a periphery, wherein the workpieces are mounted in openings provided in a carrier disk comprising a round base plate thinner than the workpieces, said carrier disk rotating during simultaneous machining of said upper and lower surfaces of the workpieces by contacting said upper and lower surfaces with moving flat bodies in the presence of an abrasive, the improvement comprising the step of:
- selecting a carrier disk made of a material having a tensile stength of at least 100 N/mm.sup.2 with inserts fixedly attached to the carrier disk inside said openings and made of a plastic material having an elastic modulus of from 1.0 to 8.10.sup.4 N/mm.sup.2 and said inserts having openings for receiving said workpieces.
In an apparatus for the bilateral abrasive machining of wafer-like workpieces having an upper and lower surface and a periphery, wherein the workpieces are mounted in openings provided in a carrier disk comprising a round base plate thinner than the workpieces, said carrier disk rotating during simultaneous machining of said upper and lower surfaces of the workpieces by contacting said upper and lower surfaces with moving flat bodies in the presence of an abrasive, the improvement comprising:
- said carrier disk made of a material having a tensile strength of at least 100 N/mm.sup.2 with inserts fixedly attached to the carrier disk inside said openings and made of a plastic material having an elastic modulus of from 1.0 to 8.10.sup.4 N/mm.sup.2 and said inserts having openings for receiving said workpieces.
Dependencies are inferred from the claim text.