B24B 37/04
Designed for working plane surfaces
Official title: designed for working plane surfaces
B24B37/04 (Designed for working plane surfaces) appears on 4,063 US grants and 4,067 published applications in this corpus.
Search patents in B24B- Granted patents
- 4,063
- Published applications
- 4,067
- Assignees
- 915
- Inventors
- 6,901
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 5 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 6 | 0 |
| 1986 | 7 | 0 |
| 1987 | 8 | 0 |
| 1988 | 8 | 0 |
| 1989 | 8 | 0 |
| 1990 | 9 | 0 |
| 1991 | 9 | 0 |
| 1992 | 18 | 0 |
| 1993 | 11 | 0 |
| 1994 | 17 | 0 |
| 1995 | 25 | 0 |
| 1996 | 33 | 0 |
| 1997 | 69 | 0 |
| 1998 | 91 | 0 |
| 1999 | 152 | 0 |
| 2000 | 193 | 0 |
| 2001 | 240 | 122 |
| 2002 | 265 | 265 |
| 2003 | 255 | 254 |
| 2004 | 217 | 240 |
| 2005 | 187 | 220 |
| 2006 | 204 | 154 |
| 2007 | 129 | 149 |
| 2008 | 87 | 137 |
| 2009 | 71 | 116 |
| 2010 | 66 | 115 |
| 2011 | 65 | 116 |
| 2012 | 86 | 115 |
| 2013 | 88 | 101 |
| 2014 | 88 | 146 |
| 2015 | 97 | 155 |
| 2016 | 100 | 127 |
| 2017 | 119 | 146 |
| 2018 | 112 | 160 |
| 2019 | 132 | 168 |
| 2020 | 122 | 141 |
| 2021 | 94 | 164 |
| 2022 | 99 | 142 |
| 2023 | 126 | 159 |
| 2024 | 125 | 175 |
| 2025 | 115 | 162 |
| 2026 | 76 | 118 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for real time inline mixing CMP slurry6 Oct 2026US 12,752,394 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Apparatus and methods for chemical mechanical polishing29 Sep 2026US 12,746,636 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for controlling chemical mechanical planarization29 Sep 2026US 12,751,254 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor processing tool and methods of operation8 Oct 2026US 2026/0307200 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Removable tray assembly for cmp systems8 Oct 2026US 2026/0307203 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing system having selectable pad conditioner height and related methods8 Oct 2026US 2026/0307204 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Slurry recycling for chemical mechanical planarazation system8 Oct 2026US 2026/0307209 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Method for shaping features of a semiconductor structure using chemical mechanical planarization (CMP)383US 5,302,233 AMicron Semiconductor, Inc. · 1994
- Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection345US 5,240,552 AMicron Technology, Inc. · 1993
- Method of modifying an exposed surface of a semiconductor wafer335US 5,958,794 AMinnesota Mining and Manufacturing Company · 1999
- Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer332US 5,081,796 AMicron Technology, Inc. · 1992