System and method for real time inline mixing CMP slurry

An inline Chemical Mechanical Polishing (CMP) slurry mixing system, comprising:

• a base slurry supply to hold a base slurry;
• additive supplies to respectively hold additives;
• a mixing device comprising:
• a container to hold the base slurry and the additives, connected to the base slurry supply controlled by a first regulator, and connected to the additive supplies respectively controlled by second regulators;
• a blender to mix the base slurry and the additives into a slurry mixture;
• and
• a heater to keep the mixing device in a temperature range;
• a first slurry dispense device to dispense the slurry mixture to a first CMP platen;
• a removal rate sensor disposed adjacent to the first CMP platen to detect an instant removal rate of the first CMP platen on a substrate;
• a signal processor to compare the instant removal rate with a reference removal rate, and to determine whether to adjust one or more of flow rates of the base slurry and the additives based on the comparing;
• and
• a process controller to adjust the one or more of the flow rates of the base slurry and the additives via the first regulator and the second regulators based on the determining.

An inline Chemical Mechanical Polishing (CMP) slurry mixing method, comprising:

• mixing, in a mixing device, a base slurry from a base slurry supply and additives respectively from additive supplies into a slurry mixture, wherein the slurry mixture is dispended by a dispense nozzle to a CMP platen;
• detecting an instant removal rate of the CMP platen on a substrate by a removal rate sensor that is positioned adjacent to the CMP platen;
• comparing the instant removal rate with a reference removal rate by a signal processor;
• determining, by the signal processor, whether to adjust at least one of flow rates of the base slurry and the additives based on the comparing of the instant removal rate and the reference removal rate;
• adjusting, by the signal processor, the at least one of the flow rates of the base slurry and the additives based on the determining of the signal processor;
• and
• storing, by the signal processor, values of the flow rates of the base slurry and the additives after a last adjusting by a process controller.