B24B 37/046
Using electric current
Official title: {using electric current}
B24B37/046 (Using electric current) appears on 138 US grants and 174 published applications in this corpus.
Search patents in B24B- Granted patents
- 138
- Published applications
- 174
- Assignees
- 65
- Inventors
- 282
- Latest grant
- 23 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 2 |
| 2002 | 4 | 7 |
| 2003 | 7 | 20 |
| 2004 | 10 | 27 |
| 2005 | 10 | 21 |
| 2006 | 20 | 20 |
| 2007 | 18 | 11 |
| 2008 | 9 | 10 |
| 2009 | 9 | 4 |
| 2010 | 6 | 4 |
| 2011 | 3 | 2 |
| 2012 | 2 | 3 |
| 2013 | 1 | 2 |
| 2014 | 2 | 2 |
| 2015 | 0 | 4 |
| 2016 | 3 | 1 |
| 2017 | 1 | 2 |
| 2018 | 1 | 3 |
| 2019 | 3 | 4 |
| 2020 | 4 | 2 |
| 2021 | 3 | 2 |
| 2022 | 3 | 4 |
| 2023 | 1 | 4 |
| 2024 | 5 | 5 |
| 2025 | 5 | 7 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chemical-mechanical polishing system with a potentiostat and pulsed-force applied to a workpiece23 Sep 2025US 12,420,374 B2Bruker Nano, Inc.
- Photoelectric fluid field cluster catalytic method for atomic-scale deterministic processing10 Jun 2025US 12,325,017 B2Zhejiang University
- Chemical mechanical polishing apparatus and method10 Jun 2025US 12,325,102 B2Taiwan Semiconductor Manufacturing Company.Ltd
- End point detection method, polishing apparatus, and polishing method29 Apr 2025US 12,285,836 B2Ebara Corporation
- Substrate polishing apparatus, substrate polishing system including the same, and substrate polishing method using the same22 Apr 2025US 12,280,466 B2Samsung Electronics Co., Ltd.
- Chemical-mechanical polishing system with a potentiostat and pulsed-force applied to a workpiece1 Jan 2026US 2026/0001188 A1Bruker Nano, Inc.
- Electrochemical polishing method employing solid electro-conductive media with bi-directional planetary motion25 Dec 2025US 2025/0387863 A1Beijing Institute of Technology
- Polishing Pad Assembly for Electrochemical Mechanical Polishing20 Nov 2025US 2025/0353136 A1Wolfspeed, Inc.
- Ionic Slurry for Electrochemical Mechanical Polishing20 Nov 2025US 2025/0357131 A1Wolfspeed, Inc.
- Chemical mechanical polishing apparatus and method28 Aug 2025US 2025/0269487 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Electroetch and chemical mechanical polishing equipment236US 6,066,030 AInternational Business Machines Corporation · 2000
- Electrochemical mechanical planarization apparatus and method211US 6,368,190 B1Agere Systems Guardian Corp. · 2002
- Apparatus for electrochemical mechanical planarization201US 5,911,619 AInternational Business Machines Corporation · 1999
- Electrochemical-control of abrasive polishing and machining rates101US 6,171,467 B2The John Hopkins University · 2001