US 12,325,102 B2 · Chemical mechanical polishing apparatus and method

Abstract

A polishing platform of a polishing apparatus includes a platen, a polishing pad, and an electric field element disposed between the platen and the polishing pad. The polishing apparatus further includes a controller configured to apply voltages to the electric field element. A first voltage is applied to the electric field element to attract charged particles of a polishing slurry toward the polishing pad. The attracted particles reduce overall topographic variation of a polishing surface presented to a workpiece for polishing. A second voltage is applied to the electric field element to attract additional charged particles of the polishing slurry toward the polishing pad. The additional attracted particles further reduce overall topographic variation of the polishing surface presented to the workpiece. A third voltage is applied to the electric field element to repel charged particles of the polishing slurry away from the polishing pad for improved cleaning thereof.

Claims20

Dependent claims

A method of manufacturing a semiconductor device, the method comprising:

distributing a chemical mechanical polishing slurry onto a platen;
and
applying a first voltage to an electric field element while the chemical mechanical polishing slurry is present on the platen, wherein the applying the first voltage electrostatically attracts oppositely charged abrasive particles within the chemical mechanical polishing slurry towards the platen;
applying a second voltage to the electric field element while the chemical mechanical polishing slurry is present on the platen, the second voltage being different from the first voltage;
removing the second voltage;
after the removing the second voltage, waiting;
and
after the waiting, applying a third voltage to the electric field element.

5 more elements

Dependencies are inferred from the claim text.

Chemical mechanical polishing apparatus and method

Life of this patent

Chemical mechanical polishing apparatus and method

Life of this patent

Abstract

Claims20