Electroetch and chemical mechanical polishing equipment
AssigneeInternational Business Machines Corporation
InventorCyprian E. Uzoh
Life of this patent
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Abstract
An apparatus for removing material from a substrate including a single platform comprising elements for performing electroetching and chemical mechanical polishing. A polishing head engages a surface of the substrate to polish the substrate. A cathode for electroetching material from the substrate. A substrate support supports a substrate to be treated. At least one slurry introduction port introduces polishing slurry between the polishing head and the substrate. A power supply supplies power to the anode and the cathode.
Claims47
An apparatus for removing material from a substrate, comprising:
- a single platform comprising elements for performing electroetching and chemical mechanical polishing;
- a polishing head for engaging a surface of the substrate to polish the substrate;
- a cathode for electroetching material from the substrate;
- a substrate support;
- at least one slurry introduction orifice for introducing polishing slurry between the polishing head and the substrate;
- and
- a power supply for supplying power to an anode and the cathode.
A method for removing material from a substrate, the method comprising:
- introducing the substrate into an apparatus that includes a single platform comprising elements for performing electroetching and chemical mechanical polishing;
- performing chemical mechanical polishing on the substrate;
- and
- performing electroetching on the substrate without transferring the substrate to another apparatus.
Dependencies are inferred from the claim text.