End point detection method, polishing apparatus, and polishing method

An end point detection method based on a drive current supplied to a drive unit, the drive unit configured to rotate and drive, based on the drive current, one of a polishing table configured to hold a polishing pad during a polishing process and a holding unit configured to hold a polishing target and to press the polishing target against the polishing pad during the polishing process, the end point detection method comprising:

• determining whether a polishing condition of the polishing process to be executed coincides with a preset specific polishing condition among the plurality of preset specific polishing conditions;
• upon determining that the polishing condition coincides with the preset specific polishing condition, adjusting a current control parameter in a drive control unit based on the preset specific polishing condition, wherein the current control parameter controls the drive current supplied to the drive unit during execution of the polishing process, and wherein the current control parameter controls an amount of a change in the drive current applied to the drive unit based on changes in a driving load of the drive unit during the polishing process;
• executing the polishing process after adjusting the current control parameter;
• during the execution of the polishing process, detecting a current drive current supplied to the drive unit;
• and
• detecting an end point of polishing based on the detected current drive current supplied to the drive unit,
• adjusting the current control parameter such that the change in the drive current becomes larger with respect to the change in the driving load of the drive unit during execution of the polishing process.

An end point detection method based on a drive current supplied to a drive unit, the drive unit configured to rotate and drive, based on the drive current, one of a polishing table configured to hold a polishing pad during a polishing process and a holding unit configured to hold a polishing target and to press the polishing target against the polishing pad during the polishing process, the end point detection method comprising:

• determining whether a polishing condition of the polishing process to be executed coincides with a preset specific polishing condition among the plurality of preset specific polishing conditions;
• upon determining that the polishing condition coincides with the preset specific polishing condition, adjusting a current control parameter in a drive control unit based on the preset specific polishing condition, wherein the current control parameter controls the drive current supplied to the drive unit during execution of the polishing process, and wherein the current control parameter controls an amount of a change in the drive current applied to the drive unit based on changes in a driving load of the drive unit during the polishing process;
• executing the polishing process after adjusting the current control parameter;
• during the execution of the polishing process, detecting a current drive current supplied to the drive unit;
• and
• detecting an end point of polishing based on the detected current drive current supplied to the drive unit,
• wherein adjusting the control parameter further comprises adjusting a current control parameter during the execution of the polishing process based on a control gain and a deviation between an actual rotational speed of at least one of the polishing table or the holding unit and a target rotational speed.

An end point detection method based on a drive current supplied to a drive unit, the drive unit configured to rotate and drive, based on the drive current, one of a polishing table configured to hold a polishing pad during a polishing process and a holding unit configured to hold a polishing target and to press the polishing target against the polishing pad during the polishing process, the end point detection method comprising:

• determining whether a polishing condition of the polishing process to be executed coincides with a preset specific polishing condition among the plurality of preset specific polishing conditions;
• upon determining that the polishing condition coincides with the preset specific polishing condition, adjusting a current control parameter in a drive unit based on the preset specific polishing condition, wherein the current control parameter controls the drive current supplied to the drive unit during execution of the polishing process, and wherein the current control parameter controls an amount of a change in the drive current applied to the drive unit based on changes in a driving load of the drive unit during the polishing process;
• executing the polishing process after adjusting the current control parameter;
• during the execution of the polishing process, detecting a current drive current supplied to the drive unit after adjustment of the current control parameter;
• and
• detecting an end point of polishing based on the detected current drive current supplied to the drive unit
• wherein when the polishing process includes a plurality of polishing stages,
• adjusting the current control parameter in at least one of the plurality of polishing stages in the adjustment step.