Substrate polishing apparatus, substrate polishing system including the same, and substrate polishing method using the same

A substrate polishing system, comprising:

• a platen;
• a polishing pad on the platen;
• a slurry supply apparatus configured to supply slurry to a top surface of the polishing pad;
• a polishing head that supports a substrate;
• and
• a platen electrode coupled to the platen,
• wherein the platen electrode includes a first electrode and a second electrode,
• wherein the second electrode surrounds the first electrode and has an annular shape, and
• wherein each of the first electrode and the second electrode is divided into a plurality of electrodes that are split along a circumferential direction of the platen,
• wherein a central axis of at least one of the first electrode and the second electrode is spaced apart from a central axis of the platen.

A substrate polishing method, comprising:

• using a polishing head to place a substrate on a platen;
• causing the substrate to contact a polishing pad, the polishing pad being configured to rotate;
• supplying slurry onto the polishing pad;
• and
• generating an electric field on the polishing pad,
• wherein generating the electric field on the polishing pad includes generating an electric field on a polishing location with which the substrate is in contact, the polishing location being a portion of a top surface of the polishing pad,
• wherein the polishing location includes a first polishing area and a second polishing area that surrounds the first polishing area, and
• wherein the generating the electric field on the polishing location includes applying a first voltage to a first electrode and a second voltage to a second electrode,
• the first electrode is beneath the first polishing area,
• the second electrode is beneath the second polishing area, and
• the second voltage is different from the first voltage,
• wherein a central axis of at least one of the first electrode or the second electrode is spaced apart from a central axis of the platen.