Polishing Pad Assembly for Electrochemical Mechanical Polishing
AssigneeWolfspeed, Inc.
InventorSimon Bubel
Life of this patent
Estimating the term…
Abstract
An example polishing system, such as an electrochemical mechanical polishing (ECMP) system, includes a polishing pad assembly having a polishing pad. The example polishing system includes a bias source. The example polishing system includes a workpiece carrier operable to bring the semiconductor workpiece into contact with the polishing pad. In some implementations, the polishing pad assembly is operable to provide an electrically conductive path for one or more charge carriers to the bias source.
Claims20
A polishing system for a semiconductor workpiece, comprising:
- a polishing pad assembly comprising a polishing pad;
- a bias source;
- a workpiece carrier operable to bring the semiconductor workpiece into contact with the polishing pad, and
- wherein the polishing pad assembly is operable to provide an electrically conductive path for one or more charge carriers to the bias source.
A polishing pad for a semiconductor workpiece, comprising:
- a composite material;
- and
- one or more conductive structures to provide an electrically conductive path through the polishing pad.
A method for polishing a surface of a workpiece, the method comprising:
- providing the surface of the workpiece on a polishing pad assembly;
- providing an electrolyte onto a surface of the polishing pad assembly;
- and
- providing a bias between the workpiece and the electrolyte through an electrically conductive path at least partially through the polishing pad assembly.
Dependencies are inferred from the claim text.