US 5,958,794 A · Method of modifying an exposed surface of a semiconductor wafer

Abstract

A method of modifying an exposed surface of a semiconductor wafer that includes the steps of: (a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abrasive particles and a binder in the form of a pre-determined pattern; and (b) relatively moving the wafer and the fixed abrasive article to modify said surface of the wafer.

Claims60

Dependent claims

A method of modifying a processed semiconductor wafer containing topographical features comprising the steps of:

(a) contacting an exposed surface of the processed semiconductor wafer with a three-dimensional, textured, fixed abrasive article comprising a plurality of abrasive particles and a binder arranged in the form of a pattern;
and
(b) relatively moving said wafer and said fixed abrasive article in the presence of a liquid medium to chemically and mechanically modify said surface of said wafer.

Dependencies are inferred from the claim text.

Facts

Application

08/694,014Filed 8 Aug 1996 · continuation in part

Priority

13 Nov 1995

Granted

28 Sep 1999

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

B24B 53/017
Devices or means for dressing or conditioning abrasive surfaces: devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 7/228
For grinding inorganic material, e.g. stone, ceramics, porcelain: for grinding thin, brittle parts, e.g. semiconductors, wafers
B24B 21/04
Machines or devices using grinding or polishing belts ; Accessories therefor: for grinding plane surfaces
B24B 37/042
Designed for working plane surfaces: operating processes therefor

Method of modifying an exposed surface of a semiconductor wafer

Life of this patent

Method of modifying an exposed surface of a semiconductor wafer

Life of this patent

Abstract

Claims60