B24B 37/042
Operating processes therefor
Official title: {operating processes therefor}
B24B37/042 (Operating processes therefor) appears on 2,125 US grants and 2,511 published applications in this corpus.
Search patents in B24B- Granted patents
- 2,125
- Published applications
- 2,511
- Assignees
- 563
- Inventors
- 4,189
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 9 | 0 |
| 1997 | 20 | 0 |
| 1998 | 17 | 0 |
| 1999 | 48 | 0 |
| 2000 | 61 | 0 |
| 2001 | 100 | 59 |
| 2002 | 133 | 149 |
| 2003 | 133 | 144 |
| 2004 | 115 | 128 |
| 2005 | 95 | 141 |
| 2006 | 120 | 96 |
| 2007 | 75 | 92 |
| 2008 | 61 | 79 |
| 2009 | 43 | 84 |
| 2010 | 35 | 72 |
| 2011 | 46 | 74 |
| 2012 | 55 | 81 |
| 2013 | 53 | 70 |
| 2014 | 60 | 100 |
| 2015 | 61 | 95 |
| 2016 | 62 | 79 |
| 2017 | 74 | 90 |
| 2018 | 70 | 90 |
| 2019 | 76 | 117 |
| 2020 | 72 | 88 |
| 2021 | 65 | 96 |
| 2022 | 66 | 83 |
| 2023 | 63 | 102 |
| 2024 | 73 | 120 |
| 2025 | 78 | 106 |
| 2026 | 58 | 76 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for real time inline mixing CMP slurry6 Oct 2026US 12,752,394 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Apparatus and methods for chemical mechanical polishing29 Sep 2026US 12,746,636 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for controlling chemical mechanical planarization29 Sep 2026US 12,751,254 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor processing tool and methods of operation8 Oct 2026US 2026/0307200 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Polishing system having selectable pad conditioner height and related methods8 Oct 2026US 2026/0307204 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing method and polishing apparatus1 Oct 2026US 2026/0295763 A1Ebara Corporation
- Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece1 Oct 2026US 2026/0295767 A1Ebara Corporation
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Method of modifying an exposed surface of a semiconductor wafer335US 5,958,794 AMinnesota Mining and Manufacturing Company · 1999
- Chemical mechanical polishing apparatus with improved carrier and method of use216US 5,624,299 AAPPLIED Materials.Inc. · 1997
- In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization198US 5,949,927 A1999
- Method of chemical mechanical polishing182US 5,934,980 AMicron Technology, Inc. · 1999