Chemical mechanical polishing apparatus with improved carrier and method of use

A method of polishing a substrate on a polishing surface, comprising the steps of:

• providing a carrier selectively positionable over the polishing surface;
• providing a recess, having an opening facing the polishing surface when the carrier is positioned over the polishing surface, in the carrier;
• extending a plate having at least one aperture therein over the opening;
• extending a flexible member over the plate and intermediate of the plate and the polishing surface so as to create a sealed cavity within the perimeter of the flexible member and the recess;
• positioning a substrate against the flexible member;
• providing a vacuum in the sealed cavity to create at least one vacuum region between the substrate and the flexible member;
• providing a retainer ring on the exposed surface of the flexible member;
• positioning the substrate within a region defined by the inner perimeter of the retainer ring;
• and
• providing an expansion seam radially outwardly of the retainer ring to enable relative motion of the retainer ring without distorting the flexible member within the inner perimeter of the retainer ring.

A carrier apparatus for removably positioning a substrate on a polishing surface, comprising;

• a body portion having an outer annular wall, a recess and an opening to said recess;
• a plate extending across said opening, said plate including an exposed face and at least one aperture from said exposed face through said plate;
• a support ring positioned in said recess, said support ring extending about the perimeter of said plate and connected to said body portion;
• a flexible member extending over said plate and between said support ring and said annular outer wall, said flexible member forming, in conjunction with said recess, a sealed cavity;
• and
• a port extending into said sealed cavity to selectively evacuate said sealed cavity.

A carrier apparatus for removably positioning a substrate on a polishing surface, comprising;

• a body portion having a recess and an opening to said recess;
• a plate extending across said opening, said plate including an exposed face and at least one aperture in said exposed face of said plate;
• a flexible member extending over said plate, said flexible member forming, in conjunction with said recess, a sealed cavity;
• a port extending into said sealed cavity to selectively evacuate said sealed cavity;
• a retaining ring connected to said flexible member and defining a substrate receiving surface of said flexible membrane within its circumference;
• and
• a material expansion member extending about the perimeter of said retainer ring.

A carrier for positioning a substrate against the surface of a polishing material, comprising:

• a body portion;
• a conformable material, having at least a first surface and a second surface, received on said body portion and deformable therefrom by the application of fluid pressure against said first surface thereof;
• a retainer connected to said second surface and defining a substrate receiving surface within its perimeter;
• and
• a flexible coupling between said retainer and portions of said conformable material disposed radially outwardly of said retainer.

A carrier apparatus for removably positioning a substrate on a polishing surface, comprising;

• a plate having an exposed face and at least one aperture in said exposed face;
• a flexible member extending over said plate, said flexible member forming, in conjunction with said aperture, a sealed cavity;
• a port extending into said sealed cavity to selectively evacuate said sealed cavity to pull said flexible member into said aperture, and to selectively pressurize said sealed cavity to urge said flexible member away from said plate;
• and
• a retainer ring connected to a movable portion of said flexible member.