B24B 37/044
Characterised by the composition of the lapping agent
Official title: {characterised by the composition of the lapping agent}
B24B37/044 (Characterised by the composition of the lapping agent) appears on 625 US grants and 935 published applications in this corpus.
Search patents in B24B- Granted patents
- 625
- Published applications
- 935
- Assignees
- 235
- Inventors
- 1,544
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 8 | 0 |
| 2001 | 16 | 10 |
| 2002 | 17 | 30 |
| 2003 | 23 | 29 |
| 2004 | 23 | 36 |
| 2005 | 16 | 36 |
| 2006 | 32 | 20 |
| 2007 | 15 | 31 |
| 2008 | 23 | 26 |
| 2009 | 12 | 25 |
| 2010 | 11 | 19 |
| 2011 | 9 | 16 |
| 2012 | 10 | 26 |
| 2013 | 14 | 37 |
| 2014 | 21 | 46 |
| 2015 | 21 | 53 |
| 2016 | 28 | 46 |
| 2017 | 33 | 51 |
| 2018 | 45 | 48 |
| 2019 | 37 | 63 |
| 2020 | 39 | 46 |
| 2021 | 44 | 45 |
| 2022 | 30 | 21 |
| 2023 | 18 | 40 |
| 2024 | 21 | 51 |
| 2025 | 29 | 44 |
| 2026 | 22 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Compositions for polishing hardmasks and related systems and methods22 Sep 2026US 12,742,097 B2Entegris, Inc.
- Chemical mechanical polishing composition and polishing method22 Sep 2026US 12,742,098 B2Jsr Corporation
- Slurry recycling for chemical mechanical polishing system25 Aug 2026US 12,721,077 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing liquid for polishing compound semiconductor substrate28 Jul 2026US 12,692,415 B2Disco Corporation
- Polishing method and polishing apparatus1 Oct 2026US 2026/0295763 A1Ebara Corporation
- Cmp polishing liquid and polishing method1 Oct 2026US 2026/0297380 A1Resonac Corporation
- Polishing composition, and polishing method24 Sep 2026US 2026/0286182 A1Fujimi Incorporated
- Polishing composition and polishing method24 Sep 2026US 2026/0286183 A1Fujimi Incorporated
- Polishing compositions and methods of use thereof24 Sep 2026US 2026/0286184 A1Fujifilm Electronic Materials U.S.A., Inc.
Most cited
By later US patents
- Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad161US 6,276,996 B1Micron Technology, Inc. · 2001
- Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same135US 6,180,029 B2Superior MicroPowders LLC · 2001
- Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same110US 6,153,123 ASuperior MicroPowders LLC · 2000
- Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates105US 6,046,111 AMicron Technology, Inc. · 2000
- Mechanical texturing of glass and glass-ceramic substrates88US 6,248,395 B1Komag, Inc. · 2001