Mechanical texturing of glass and glass-ceramic substrates
AssigneeKomag, Inc.
InventorsAndrew M. Homola, Javier Wong
Life of this patent
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Abstract
A method for polishing a glass or glass ceramic substrate comprises the step of using a slurry comprising both diamond and CeO2 particles. We have discovered that the presence of both diamond and CeO2 particles permits one to polish at a high glass removal rate, and concurrently, to leave a texture on the surface of the glass substrate.
Claims43
A method for texturing a silica-containing magnetic recording medium substrate comprising the steps of abrading the substrate with a slurry, said slurry including diamond and CeO2 particles, said diamond mechanically abrading said substrate but not causing chemical-mechanical polishing of said substrate, said CeO2 particles causing chemical-mechanical polishing of said substrate.
A method for polishing and texturing a silica-containing magnetic recording medium substrate comprising the steps of abrading the substrate with a slurry, said slurry including a first material and a second material, said first material comprising one or more of CeO2, ZrO2, ThO2, TiO2, Fe2O3, SnO2, Cr2O3 and Al2O3, said second material comprising one or more of diamond, SiC, B4C, AlB, TiC and W2C, said first material causing chemical-mechanical polishing of said substrate, said second material mechanically abrading said substrate but not causing chemical-mechanical polishing of said substrate.
Method of texturing a silica-containing magnetic recording medium substrate comprising the steps of abrading the substrate with a slurry, said slurry including particles of a first material and particles of a second material, said first material comprising cerium in a form having a valence of 4, said particles of said second material having a hardness of at least 7 on the Mohs scale, said particles of said first material causing chemical-mechanical polishing of said substrate, said particles of said second material mechanically abrading said substrate but not causing chemical-mechanical polishing of said substrate.
Method of polishing a silica-containing magnetic recording medium substrate comprising abrading said substrate with a slurry, said slurry comprising a first group of particles made from a first material and a second group of particles made from a second material which is different from said first material, said first material causing chemical mechanical polishing of said substrate, said second material mechanically abrading said substrate but not causing chemical-mechanical polishing of said substrate.
Dependencies are inferred from the claim text.