Polishing composition and polishing method

Abstract

The present disclosure provides a polishing composition which has an excellent step elimination ability on an object to be polished, which enhances the ratio (selection ratio) of the polishing removal rate of a material having silicon-silicon bonds to the polishing removal rate of a material having silicon-nitrogen bonds, and which is also excellent in scratch reduction on a surface of a polished object to be polished. The present disclosure relates to a polishing composition containing (A) at least one selected from the group consisting of a water-soluble polymer having a lactam structure and a water-soluble polymer having a cellulose structure, and (B) an inorganic salt, wherein the electrical conductivity is 1 mS/cm or more and 50 mS/cm or less, the total concentration of sodium ions and potassium ions is 1000 ppm by mass or less, and the pH is 8 or more and 12 or less.

Dependencies are inferred from the claim text.