Polishing composition, and polishing method

Abstract

The present disclosure provides a polishing composition having excellent storage stability that shows little change in polishing removal rate even after long-term storage, can stably maintain polishing performance, and can suppress proliferation of viable bacteria. The present disclosure is a polishing composition contains: (A) abrasive grains; (B) a biocide; (C) a polishing removal rate improver for a material having a silicon-silicon bond; and (D) a polyoxyalkylene compound, wherein the component (B) is at least one selected from the group consisting of an isothiazolinone compound and a thiazolinone compound, and wherein the component (C) is a water-soluble polymer other than the component (D).

Dependencies are inferred from the claim text.