Methods and apparatus for polishing a semiconductor wafer
AssigneeWestern Electric Company, Inc.
InventorEdward L. Banks
Life of this patent
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Abstract
A semiconductor wafer (31) is placed in a holder (10) and then positioned on a polishing pad (35) in a polishing machine (40). A mechanical force is applied to the holder (10) to cause a predetermined pressure on the wafer (31) therein as the polishing pad (35) is rotated. Simultaneously, water at a pressure slightly higher than the pressure applied to the wafer (31) is injected into the holder to form a water bearing layer between the wafer and the holder that permits free floating rotative motion of the wafer as it is being polished.
Claims5
A method of polishing a wafer, comprising the steps of:
- capturing the wafer between a holding means and a rotating polishing pad;
- and
- continuously injecting a liquid under pressure, between the wafer and the holding means to permit free floating rotative motion of the wafer during polishing.
A method of polishing a semiconductor wafer, comprising the steps of:
- applying a pressure to the wafer by urging a holder, having a plurality of channels therethrough, towards a rotating polishing pad with the wafer interposed therebetween;
- and
- flowing a liquid, under a pressure greater than the applied pressure, through the channels to interpose a layer of liquid between the wafer and the holder to permit free floating rotative motion of the wafer during polishing.
Apparatus for polishing a wafer, comprising:
- a rotatable polishing means;
- means for holding the wafer on the polishing means;
- and
- means for injecting a liquid, under pressure between the holding means and the wafer to permit free floating, rotative motion of the wafer as the polishing means rotates to polish said wafer.
Dependencies are inferred from the claim text.