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US 2026/0216843 A1Published application
Chemical mechanical polishing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsDong Hoon KWON, Seung Yong YU, Jin-Woo BAE, Young In KIM, So Hyeon PARK, Ji Hoon PARK, Hyo Jin PARK, In Hak JEON, Byung Soo JOO
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Abstract
A chemical mechanical polishing apparatus includes a head configured to mount a wafer thereon, a spindle connected to the head; a support horizontally extending from the spindle, and a shock wave module disposed on a lower surface of the support, configured to generate a shock wave that is applied to the head.
Claims20
A chemical mechanical polishing apparatus comprising:
- a head configured to mount a wafer thereon;
- a spindle vertically extending from the head;
- a support horizontally extending from the spindle;
- and
- a shock wave module disposed on a lower surface of the support, and configured to generate a shock wave that is applied to the head.
2 more elements
A chemical mechanical polishing apparatus comprising:
- a head configured to mount a wafer thereon;
- a spindle connected to the head;
- a support connected to the spindle;
- a head pad disposed on an upper surface of the head;
- a coupler disposed between the head and the head pad;
- and
- a shock wave module connected to a lower surface of the support, and configured to generate a shock wave and apply the shock wave to the head pad,
- wherein the shock wave module is spaced apart from the head pad.
5 more elements
A chemical mechanical polishing apparatus comprising:
- a head configured to mount a wafer thereon;
- a spindle vertically extending from the head;
- a plurality of supports each extending from the spindle horizontally;
- a plurality of head pads disposed on the head;
- and
- a plurality of shock wave modules, each connected to a lower surface of a corresponding support and positioned vertically above a corresponding head pad to generate and apply a shock wave to the corresponding head pad.
3 more elements
Dependencies are inferred from the claim text.