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US 2026/0200035 A1Published application
Wafer polishing device
AssigneeSamsung Electronics Co., Ltd.
InventorsWon Guk SEO, Boun YOON, Jinhan CHOI, Juno PARK, Ki Hoon JANG
Life of this patent
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Abstract
Provided is a wafer polishing device including: a table configured to mount a wafer and to rotate the wafer; and a polisher spaced apart from a first surface of the wafer and configured to polish the first surface of the wafer by spraying a fluid toward the first surface of the wafer, wherein a length of the polisher is greater than a radius of the wafer.
Claims20
A wafer polishing device comprising:
- a table configured to mount a wafer and to rotate the wafer;
- and
- a polisher spaced apart from a first surface of the wafer and configured to polish the first surface of the wafer by spraying a fluid toward the first surface of the wafer,
- wherein a length of the polisher is greater than a radius of the wafer.
1 more element
A wafer polishing device comprising:
- a table configured to mount a wafer and to rotate the wafer;
- a polisher configured to polish a first surface of the wafer while being spaced apart from the first surface of the wafer;
- and
- a measurer configured to measure a thickness of the wafer.
1 more element
A wafer polishing device comprising:
- a table comprising a first surface configured to mount a wafer;
- a temperature regulator configured to contact a second surface of the wafer;
- a rotation shaft configured to rotate the table;
- a polisher spaced apart from a first surface of the wafer, the polisher comprising a plurality of nozzles configured to spray fluid;
- a pressure controller configured to control a pressure of the fluid;
- a measurer configured to measure a thickness of the wafer;
- and
- a reactant supply configured to supply a reactant toward the first surface of the wafer.
5 more elements
Dependencies are inferred from the claim text.