Polishing apparatus, substrate processing apparatus, polishing method, and determination device
AssigneeEbara Corporation
InventorsMasaki KINOSHITA, Ji Chul YANG
Life of this patent
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AssigneeEbara Corporation
InventorsMasaki KINOSHITA, Ji Chul YANG
Estimating the term…
Particles that damage a substrate are detected more efficiently or more precisely. A polishing apparatus includes a detector that performs detection of a signal related to at least one of a size, shape, dispersibility, and optical property of particles, from a polishing liquid positioned on a polishing surface, or the polishing liquid positioned in a flow path or a chamber that communicates with a pad opening portion formed in a polishing pad, and a control device is configured to perform particle determination to determine whether the polishing liquid on which the detection is performed contains particles that damage the substrate, based on particle data indicating at least one of the size, shape, dispersibility, and optical property of particles obtained based on the signal detected by the detector, and correspondence information indicating correspondence of the size of the particle of the polishing liquid, and whether the particles are the particles that damage the substrate.
A polishing apparatus, comprising:
A polishing method for performing polishing of a substrate by bringing a polishing pad and the substrate into contact with each other in presence of a polishing liquid by a polishing apparatus including
A determination device that determines a state of a polishing liquid in a polishing apparatus, wherein
Dependencies are inferred from the claim text.