Y10S 148/164
Three dimensional processing
Y10S148/164 (Three dimensional processing) appears on 69 US grants and 5 published applications in this corpus.
Search patents in Y10S- Granted patents
- 69
- Published applications
- 5
- Assignees
- 28
- Inventors
- 107
- Latest grant
- 26 Mar 2013
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 10 | 0 |
| 1988 | 6 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 1 | 2 |
| 2013 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Three-dimensional integrated circuits with protection layers26 Mar 2013US 8,405,225 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional integrated circuits with protection layers3 Apr 2012US 8,148,826 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional integrated circuits with protection layers8 Nov 2011US 8,053,277 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional integrated circuits with protection layers12 Oct 2010US 7,812,459 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Forming a plurality of thin-film devices27 Mar 2007US 7,195,950 B2Hewlett-Packard Development Company, L. P.
- Three-Dimensional Integrated Circuits with Protection Layers26 Jul 2012US 2012/0187576 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional integrated circuits with protection layers9 Feb 2012US 2012/0032348 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Three-Dimensional Integrated Circuits with Protection Layers30 Dec 2010US 2010/0330743 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional integrated circuits with protection layers19 Jun 2008US 2008/0142990 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Forming a plurality of thin-film devices26 Jan 2006US 2006/0019504 A1Hewlett-Packard Development Company, L. P.
Most cited
By later US patents
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Method for forming three dimensional processor using transferred thin film circuits348US 5,656,548 AKopin Corporation · 1997
- Multilevel integrated circuits employing fused oxide layers334US 4,829,018 A1989
- Three dimensional processor using transferred thin film circuits281US 6,624,046 B1Kopin Corporation · 2003
- Three dimensional processor using transferred thin film circuits192US 5,793,115 AKopin Corporation · 1998