H10W 80/102
Controlling the environment during the bonding
Official title: {Controlling the environment during the bonding, e.g. the temperature or pressure}
H10W80/102 (Controlling the environment during the bonding) appears on 490 US grants and 642 published applications in this corpus.
Search patents in H10W- Granted patents
- 490
- Published applications
- 642
- Assignees
- 101
- Inventors
- 806
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 0 | 3 |
| 2012 | 1 | 6 |
| 2013 | 7 | 15 |
| 2014 | 12 | 11 |
| 2015 | 9 | 18 |
| 2016 | 12 | 10 |
| 2017 | 8 | 9 |
| 2018 | 21 | 24 |
| 2019 | 21 | 28 |
| 2020 | 23 | 42 |
| 2021 | 60 | 113 |
| 2022 | 68 | 124 |
| 2023 | 86 | 77 |
| 2024 | 81 | 65 |
| 2025 | 65 | 52 |
| 2026 | 16 | 44 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of assembly by direct bonding of electronic components25 Aug 2026US 12,721,248 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Semiconductor device11 Aug 2026US 12,708,016 B2Samsung Electronics Co., Ltd.
- Semiconductor structure and manufacturing method thereof11 Aug 2026US 12,708,021 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with volumetrically-expanded side-connected interconnects11 Aug 2026US 12,708,042 B2Micron Technology, Inc.
- Systems and methods for bonding semiconductor devices28 Jul 2026US 12,696,826 B2Tokyo Electron Limited
- Package method and package system17 Sep 2026US 2026/0282788 A1CXMT Corporation
- Liquid cooling module20 Aug 2026US 2026/0248011 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect stack and a method for forming the same13 Aug 2026US 2026/0239928 A1JCET STATS ChipPAC Korea Limited
- Structure and formation method of package with crack-stopping structure13 Aug 2026US 2026/0239986 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of Fine Pitch Hybrid Bonding with Dissimilar CTE Wafers and Resulting Structures13 Aug 2026US 2026/0240058 A1Apple Inc.
Most cited
By later US patents
- Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers256US 8,809,123 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018
- Semiconductor device252US 9,799,587 B2Sony Corporation · 2017
- Wafer-to-wafer bonding structure251US 9,941,243 B2Samsung Electronics Co., Ltd. · 2018
- 3D integrated circuit and methods of forming the same247US 9,257,399 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016