Structure and formation method of package with crack-stopping structure

A method for forming a package structure, comprising:

• receiving a first chip-containing structure;
• forming a crack-stopping structure extending into the first chip-containing structure, wherein the crack-stopping structure laterally surrounds an inner portion of the first chip-containing structure;
• forming a dielectric bonding structure over the first chip-containing structure;
• forming a plurality of metal bonding structures extending into the first chip-containing structure, wherein top surfaces of the metal bonding structures and the dielectric bonding structure are level;
• and
• bonding a second chip structure to the dielectric bonding structure and the metal bonding structures through dielectric-to-dielectric bonding and metal-to-metal bonding.

A package structure, comprising:

• a first chip-containing structure;
• a dielectric bonding structure over the first chip-containing structure;
• a plurality of metal bonding structures laterally surrounded by the dielectric bonding structure, wherein top surfaces of the metal bonding structures and the dielectric bonding structure are level;
• a second chip-containing structure bonded to the dielectric bonding structure and the metal bonding structures through dielectric-to-dielectric bonding and metal-to-metal bonding;
• and
• a crack-stopping structure extending into the first chip-containing structure, wherein the crack-stopping structure is between an inner portion of the first chip-containing structure and an outer metal bonding structure of the metal bonding structures, and the outer metal bonding structure is between an edge of the first chip-containing structure and the outer metal bonding structure.