H10W 80/016
Cleaning
Official title: {Cleaning}
H10W80/016 (Cleaning) appears on 497 US grants and 680 published applications in this corpus.
Search patents in H10W- Granted patents
- 497
- Published applications
- 680
- Assignees
- 111
- Inventors
- 876
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 2 |
| 2008 | 0 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 5 |
| 2013 | 6 | 11 |
| 2014 | 7 | 10 |
| 2015 | 7 | 18 |
| 2016 | 16 | 20 |
| 2017 | 18 | 17 |
| 2018 | 24 | 19 |
| 2019 | 23 | 42 |
| 2020 | 38 | 82 |
| 2021 | 55 | 106 |
| 2022 | 67 | 79 |
| 2023 | 69 | 70 |
| 2024 | 70 | 87 |
| 2025 | 67 | 59 |
| 2026 | 29 | 51 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Direct bonding methods and structures29 Sep 2026US 12,751,323 B2Adeia Semiconductor Bonding Technologies Inc.
- Method of assembly by direct bonding of electronic components25 Aug 2026US 12,721,248 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Electronic devices and methods of manufacturing electronic devices18 Aug 2026US 12,713,952 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor structure and manufacturing method thereof11 Aug 2026US 12,708,021 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Direct-bonded optoelectronic devices11 Aug 2026US 12,708,053 B2Adeia Semiconductor Technologies LLC
- Method for cleaning semiconductor chip, and method for manufacturing semiconductor device1 Oct 2026US 2026/0305220 A1
- Substrate layered body producing method and substrate layered body1 Oct 2026US 2026/0305462 A1Mitsui Chemicals, Inc.
- Method for manufacturing substrate laminate3 Sep 2026US 2026/0262539 A1Mitsui Chemicals, Inc.
- Structure and formation method of package with crack-stopping structure13 Aug 2026US 2026/0239986 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor bonding surface with multiple passivation materials13 Aug 2026US 2026/0240056 A1Micron Technology, Inc.
Most cited
By later US patents
- Bonding structure for stacked semiconductor devices254US 9,230,941 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018
- Wafer-to-wafer bonding structure251US 9,941,243 B2Samsung Electronics Co., Ltd. · 2018
- Conductive pad structure for hybrid bonding and methods of forming same243US 9,437,572 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods240US 8,501,537 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives · 2013