H10W 72/967
Multiple bond pads having different functions
Official title: {Multiple bond pads having different functions}
H10W72/967 (Multiple bond pads having different functions) appears on 678 US grants and 918 published applications in this corpus.
Search patents in H10W- Granted patents
- 678
- Published applications
- 918
- Assignees
- 141
- Inventors
- 1,295
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 0 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 1 | 6 |
| 2006 | 2 | 1 |
| 2007 | 1 | 5 |
| 2008 | 5 | 6 |
| 2009 | 3 | 4 |
| 2010 | 2 | 7 |
| 2011 | 9 | 9 |
| 2012 | 5 | 13 |
| 2013 | 9 | 14 |
| 2014 | 17 | 18 |
| 2015 | 19 | 29 |
| 2016 | 27 | 33 |
| 2017 | 22 | 18 |
| 2018 | 31 | 35 |
| 2019 | 37 | 45 |
| 2020 | 48 | 80 |
| 2021 | 54 | 99 |
| 2022 | 77 | 131 |
| 2023 | 81 | 109 |
| 2024 | 93 | 102 |
| 2025 | 86 | 81 |
| 2026 | 46 | 70 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package with stacked dies and thermal substrate encapsulation6 Oct 2026US 12,757,780 B2Taiwan Semiconductor Manufacturing Company.Ltd
- 3D IC structure22 Sep 2026US 12,745,405 B2Etron Technology, Inc.
- Image sensor and method of manufacturing image sensor15 Sep 2026US 12,740,175 B2Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing the semiconductor package15 Sep 2026US 12,740,485 B2Samsung Electronics Co., Ltd.
- Package structure having a semiconductor functional structure and redistribution layers (RDLs)8 Sep 2026US 12,733,459 B2Changxin Memory Technologies, Inc.
- Semiconductor device8 Oct 2026US 2026/0314474 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with integrated deep trench capacitors1 Oct 2026US 2026/0305323 A1Mediatek Inc.
- Semiconductor package1 Oct 2026US 2026/0305356 A1Samsung Electronics Co., Ltd.
- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0305500 A1Resonac Corporation
- Semiconductor device including dummy pad17 Sep 2026US 2026/0282393 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack497US 6,661,085 B2Intel Corporation · 2003
- Bonding structure for stacked semiconductor devices254US 9,230,941 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Hybrid bonding with uniform pattern density252US 9,299,736 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor device252US 9,799,587 B2Sony Corporation · 2017