H10W 72/534
Being rectangular
Official title: {being rectangular}
H10W72/534 (Being rectangular) appears on 1,076 US grants and 1,111 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,076
- Published applications
- 1,111
- Assignees
- 332
- Inventors
- 1,899
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 7 | 0 |
| 1988 | 4 | 0 |
| 1989 | 8 | 0 |
| 1990 | 7 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 5 | 0 |
| 1994 | 7 | 0 |
| 1995 | 6 | 0 |
| 1996 | 8 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 16 | 0 |
| 2000 | 12 | 0 |
| 2001 | 13 | 14 |
| 2002 | 18 | 14 |
| 2003 | 21 | 25 |
| 2004 | 21 | 26 |
| 2005 | 20 | 28 |
| 2006 | 20 | 31 |
| 2007 | 20 | 48 |
| 2008 | 23 | 60 |
| 2009 | 32 | 85 |
| 2010 | 41 | 80 |
| 2011 | 66 | 92 |
| 2012 | 65 | 64 |
| 2013 | 82 | 64 |
| 2014 | 68 | 53 |
| 2015 | 63 | 63 |
| 2016 | 59 | 46 |
| 2017 | 52 | 54 |
| 2018 | 42 | 38 |
| 2019 | 31 | 43 |
| 2020 | 44 | 41 |
| 2021 | 31 | 39 |
| 2022 | 30 | 43 |
| 2023 | 27 | 18 |
| 2024 | 29 | 16 |
| 2025 | 15 | 13 |
| 2026 | 8 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Electronic part and semiconductor device24 Mar 2026US 12,588,514 B2Rohm Co., Ltd.
- Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor17 Mar 2026US 12,581,983 B2Danfoss Silicon Power GmbH
- Semiconductor device30 Jul 2026US 2026/0223719 A1Sumitomo Electric Device Innovations, Inc.
- Package with Lateral Semiconductor Flip-Chip and Bond Wires Crossing and Bridging a Routing Structure23 Jul 2026US 2026/0215297 A1Infineon Technologies Austria AG
- Wire post bump forming process23 Jul 2026US 2026/0215313 A1Texas Instruments Incorporated
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Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Method for producing high speed integrated circuits354US 5,214,845 AMicron Technology, Inc. · 1993
- Method of fabricating an interconnection element335US 6,336,269 B12002
- Backside method for fabricating semiconductor components with conductive interconnects311US 7,393,770 B2Micron Technology, Inc. · 2008