Power module having at least three power units
AssigneeSiemens Aktiengesellschaft
InventorsJens Schmenger, Roman Kögler, Alexander Luft, Lutz Namyslo, Bernd Roppelt, Thomas Schwinn
Life of this patent
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Abstract
A power module includes at least two power units. Each power unit includes at least one power semiconductor and a substrate. In order to reduce the installation space required for the power module and to improve cooling, the at least one power semiconductor is connected, in particular in a materially bonded manner, to the substrate. The substrates of the at least two power units are each directly connected in a materially bonded manner to a surface of a common heat sink. A power converter having at least one power module is also disclosed.
Claims19
A power module, comprising:
- a heat sink configured to enable a gaseous coolant to flow in a direction of coolant flow substantially parallel to a surface of the heat sink, said heat sink comprising cooling ribs extending in the direction of coolant flow;
- at least three power units, each of the at least three power units comprising a substrate and a power semiconductor connected to the substrate, in particular in a materially bonded manner, with the substrates of the at least three power units being directly connected in a materially bonded manner to the surface of the common heat sink, said at least three power units arranged offset transversely to the direction of coolant flow;
- a power board arranged to run substantially parallel to the surface of the heat sink;
- and
- freely positionable contacts configured to connect the power board to the at least three power units.
A power converter, comprising a power module, said power module comprising a heat sink configured to enable a gaseous coolant to flow in a direction of coolant flow substantially parallel to a surface of the heat sink, sald heat sink comprising cooling ribs extending in the direction of coolant flow, at least three power units, each of the at least three power units comprising a substrate and a power semiconductor connected to the substrate, in particular in a materially bonded manner, with the substrates of the at least three power units being directly connected in a materially bonded manner to the surface of the common heat sink, said at least three power units arranged offset transversely to the direction of coolant flow, a power board arranged to run substantially parallel to the surface of the heat sink, and freely positionable contacts configured to connect the power board to the at least three power units.
Dependencies are inferred from the claim text.