Power semiconductor module arrangement and method for producing a power semiconductor module arrangement

A power semiconductor module arrangement, comprising:

• a housing;
• a substrate comprising a substrate layer and a first metallization layer deposited on a first side of the substrate layer, and arranged inside the housing or forming a bottom of the housing;
• a printed circuit board arranged inside the housing, vertically above and in parallel to the substrate;
• a plurality of electrically conducting components arranged on the printed circuit board and on the substrate;
• an encapsulant at least partly filling the interior of the housing, thereby covering the substrate;
• and
• a magnetic field sensor,
• wherein either the magnetic field sensor is arranged on the substrate within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the printed circuit board, or the magnetic field sensor is arranged on the printed circuit board within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the substrate,
• wherein the magnetic field sensor is electrically insulated from the respective electrically conducting component.