H10W 72/01233
In liquid form
Official title: {in liquid form, e.g. spin coating, spray coating or immersion coating}
H10W72/01233 (In liquid form) appears on 2,570 US grants and 3,087 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,570
- Published applications
- 3,087
- Assignees
- 451
- Inventors
- 3,612
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 7 | 3 |
| 2002 | 12 | 10 |
| 2003 | 7 | 9 |
| 2004 | 10 | 16 |
| 2005 | 6 | 26 |
| 2006 | 11 | 27 |
| 2007 | 13 | 24 |
| 2008 | 15 | 47 |
| 2009 | 22 | 34 |
| 2010 | 29 | 48 |
| 2011 | 35 | 102 |
| 2012 | 62 | 170 |
| 2013 | 105 | 205 |
| 2014 | 154 | 208 |
| 2015 | 203 | 242 |
| 2016 | 217 | 202 |
| 2017 | 241 | 232 |
| 2018 | 205 | 186 |
| 2019 | 196 | 243 |
| 2020 | 204 | 233 |
| 2021 | 172 | 219 |
| 2022 | 190 | 174 |
| 2023 | 149 | 117 |
| 2024 | 142 | 130 |
| 2025 | 105 | 117 |
| 2026 | 44 | 63 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Sintered metal flip chip joints18 Aug 2026US 12,713,938 B2Texas Instruments Incorporated
- Thick redistribution layer features11 Aug 2026US 12,707,653 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device11 Aug 2026US 12,707,942 B2Samsung Electronics Co., Ltd.
- Integrated circuit having a routable leadframe11 Aug 2026US 12,707,986 B2Texas Instruments Incorporated
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Semiconductor packages with separately plated metal pillars1 Oct 2026US 2026/0305410 A1Texas Instruments Incorporated
- Semiconductor structure and fabrication method thereof1 Oct 2026US 2026/0305439 A1United Microelectronics Corp.
- Multi-layer metal stack for wire bonding1 Oct 2026US 2026/0305453 A1
- Co-integration of Airbridges and 3D Integration Modules24 Sep 2026US 2026/0293678 A1
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Wafer scale packaging scheme253US 6,103,552 A2000
- Method of making microelectronic spring contact elements226US 6,184,053 B2FormFactor, Inc. · 2001
- Bump structure, bump forming method and package connecting body200US 6,229,220 B1International Business Machines Corporation · 2001