H10W 20/4473
Conductive organic materials
Official title: {Conductive organic materials, e.g. conductive adhesives or conductive inks}
H10W20/4473 (Conductive organic materials) appears on 165 US grants and 133 published applications in this corpus.
Search patents in H10W- Granted patents
- 165
- Published applications
- 133
- Assignees
- 93
- Inventors
- 376
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 7 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 9 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 8 | 0 |
| 2001 | 8 | 3 |
| 2002 | 5 | 13 |
| 2003 | 13 | 6 |
| 2004 | 5 | 7 |
| 2005 | 2 | 2 |
| 2006 | 4 | 6 |
| 2007 | 2 | 1 |
| 2008 | 2 | 5 |
| 2009 | 1 | 3 |
| 2010 | 5 | 2 |
| 2011 | 2 | 4 |
| 2012 | 0 | 2 |
| 2013 | 3 | 2 |
| 2014 | 2 | 12 |
| 2015 | 8 | 14 |
| 2016 | 12 | 12 |
| 2017 | 7 | 13 |
| 2018 | 11 | 9 |
| 2019 | 10 | 4 |
| 2020 | 7 | 2 |
| 2021 | 0 | 0 |
| 2022 | 3 | 1 |
| 2023 | 0 | 5 |
| 2024 | 1 | 3 |
| 2025 | 0 | 0 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ultrastrong aerogels based on aramid nanofiber composites and membrane devices made therefrom9 Jun 2026US 12,649,835 B2Advanced Biomedical Instrumental Centre Limited
- Electronic device and variable frequency control system using electronic device2 Jun 2026US 12,648,448 B2Copeland Climate Technologies (Suzhou) Co. Ltd.
- Fill of vias in single and dual damascene structures using self-assembled monolayer7 Apr 2026US 12,598,977 B2Intel Corporation
- Power module6 Jan 2026US 12,519,032 B2Sumitomo Bakelite Co., Ltd.
- Semiconductor structure with two-dimensional conductive structures20 Aug 2024US 12,068,253 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device including interconnect structure and method for manufacturing the same26 Feb 2026US 2026/0060065 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and manufacturing method thereof22 Jan 2026US 2026/0026338 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and method of manufacturing the same31 Oct 2024US 2024/0363538 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Ultrastrong Aerogels Based on Aramid Nanofiber Composites and Membrane Devices Made Therefrom15 Aug 2024US 2024/0270916 A1Advanced Biomedical Instrumentation Centre Limited
- Electronic device and variable frequency control system using electronic device15 Aug 2024US 2024/0274546 A1Emerson Climate Technologies (Suzhou) Co., Ltd.
Most cited
By later US patents
- Materials and products using nanostructured non-stoichiometric substances226US 6,344,271 B12002
- Nanotechnology for biomedical products224US 6,572,672 B2NanoProducts Corporation · 2003
- Flip chip technology using electrically conductive polymers and dielectrics219US 5,074,947 AEpoxy Technology, Inc. · 1991
- Flip chip bonding method using electrically conductive polymer bumps194US 5,196,371 AEpoxy Technology, Inc. · 1993
- Flip chip technology using electrically conductive polymers and dielectrics167US 5,237,130 AEpoxy Technology, Inc. · 1993