Power module

A power module comprising:

• a power semiconductor element;
• and
• a first heat dissipation structure having the power semiconductor element provided on one surface side,
• wherein the first heat dissipation structure includes
• a first metal circuit board,
• a first joining layer provided for joining the power semiconductor element to one surface of the first metal circuit board by using a sintering paste, and
• a first heat dissipation sheet provided for joining a first heat dissipation member to the other surface of the first metal circuit board, and
• wherein in a laminated structure A in which the power semiconductor element, the first joining layer, the first metal circuit board, and the first heat dissipation sheet are laminated, a total thermal resistance in a direction of lamination is equal to or less than 0.30 (K/W),
• wherein the first heat dissipation sheet is formed by using a resin composition for a sheet, and
• wherein the resin composition for the sheet includes a thermosetting resin (A), a filler (B) and a curing agent (C).